MARKET OVERVIEW

Photoresist Stripping Equipment Market size was valued at USD 764.2 million in 2025 and is projected to reach USD 1,368.5 million by 2033, growing at a CAGR of 7.5% during the forecast period. The market is driven by the rapid advancement in semiconductor manufacturing, where precise photoresist removal is essential for high-performance integrated circuits. These equipment systems are used to clean wafers during fabrication, ensuring accurate pattern transfer and minimizing defects. Increasing miniaturization of electronic components, along with growing investments in AI chips, 5G infrastructure, and automotive electronics, are significantly propelling the demand for advanced photoresist stripping technologies. As the industry moves toward sub-7nm nodes, ultra-clean wafer processing becomes critical, pushing adoption of high-precision, plasma-based, and wet chemical stripping systems. Environmental regulations and the need for reduced chemical usage are also encouraging the development of eco-friendly stripping processes. Furthermore, with the expansion of foundries in Asia-Pacific and strong demand from memory and logic chip producers, the photoresist stripping equipment market is poised for steady long-term growth.

DRIVER:-

The primary driver of the Photoresist Stripping Equipment Market is the growing complexity and density of semiconductor devices. As manufacturers transition to advanced nodes (such as 5nm and below), precise and defect-free photoresist removal becomes a critical step in wafer fabrication. In 2025, the global production of chips smaller than 7nm increased by over 28%, leading to a rise in demand for high-end stripping systems that support both wet and dry processes. Additionally, the rise in AI, automotive, and 5G devices requires chips with smaller features and higher performance, necessitating better cleaning and etching precision. This equipment ensures minimal damage to wafers and helps in cost-effective mass production by reducing yield losses. Leading players in the semiconductor industry—such as TSMC, Samsung, and Intel—are investing heavily in new fabs, which in turn boosts the demand for next-gen stripping systems.

COUNTRY/REGION:-

Asia-Pacific dominates the global photoresist stripping equipment market, accounting for more than 60% of the global revenue in 2025. This dominance is attributed to the strong presence of major foundries and semiconductor manufacturing units in countries like Taiwan, South Korea, China, and Japan. Taiwan alone contributes over 25% of global wafer output, led by giants like TSMC. South Korea’s Samsung and SK Hynix, along with China's aggressive expansion of its semiconductor ecosystem, are fueling continuous demand. Japan remains a crucial supplier of precision semiconductor tools and materials. North America follows, with major investments in advanced fabrication facilities by Intel and GlobalFoundries in the U.S. Europe’s presence is steady due to semiconductor initiatives in Germany and the Netherlands, while the Middle East & Africa are gradually catching up due to rising demand for chip imports and localized electronics manufacturing.

SEGMENT:-

In 2025, the dry stripping segment held the largest market share at over 55%, primarily due to its precision, compatibility with advanced nodes, and ability to avoid damage to delicate wafer layers. Plasma-based systems, which are part of the dry stripping category, are in high demand for next-generation logic and memory devices. The wet stripping segment continues to be relevant for legacy nodes and certain MEMS applications. From an end-user perspective, foundries and IDMs (Integrated Device Manufacturers) are the largest consumers of photoresist stripping equipment, driven by increasing chip demand across industries. The memory sector, especially DRAM and NAND production, holds a significant share, while logic chips and sensor applications are expanding rapidly due to their use in automotive and consumer electronics.

MARKET TRENDS

The photoresist stripping equipment market is evolving with several emerging trends. One key trend is the increasing shift toward plasma-based dry stripping for precision, low-damage processes in sub-5nm and 3nm technologies. Companies are also integrating AI and machine learning to optimize process control and monitor wafer-level stripping in real-time, reducing yield loss. Another significant trend is the development of environmentally friendly wet chemical solutions that reduce water and chemical consumption. Additionally, modular stripping systems with advanced automation are gaining traction to enhance throughput in high-volume manufacturing. Demand is also rising for multi-function etch and strip tools, which combine photoresist removal with surface cleaning, reducing tool footprint and cost. As the industry prepares for the era of heterogeneous integration and chiplet architecture, customized stripping solutions are being designed for advanced packaging and 3D IC production.

MARKET DYNAMICS

DRIVER-

Rising demand for advanced semiconductor chips in AI, 5G, and automotive sectors is pushing the need for precise photoresist stripping equipment. The growth of advanced nodes like 3nm further amplifies this requirement.

RESTRAINT-

High equipment cost and long return on investment (ROI) hinder small and mid-sized fabs from adopting advanced stripping systems, slowing broader market penetration.

OPPORTUNITY-

The increasing government support for domestic semiconductor manufacturing in regions like India, the U.S., and Europe presents new opportunities for equipment vendors.

CHALLENGE-

Adapting stripping technologies to frequent material changes and evolving device structures is a major technical challenge for equipment manufacturers.

MARKET SEGMENTATION

By Type-

Dry stripping equipment leads the segment with over 55% share due to its non-contact nature and suitability for nanoscale geometries. Plasma-based systems are extensively used for advanced logic and memory nodes. Wet stripping equipment still sees demand for older node devices and MEMS where chemical-based removal suffices.

By Application-

Foundries and IDMs are the major application segments, accounting for most equipment installations. Among devices, logic ICs and memory chips dominate usage due to their complex layer structures. Sensor and analog IC manufacturers also contribute to demand in automotive and consumer applications.

REGIONAL OUTLOOK

North America-

Home to key players like Applied Materials and Lam Research, the U.S. is witnessing strong demand due to the CHIPS Act and new fab investments.

Europe-

Germany and the Netherlands are expanding semiconductor equipment and R&D efforts. ASML’s EUV leadership indirectly supports this market through wafer cleaning stages.

Asia-Pacific-

Leads globally with extensive production facilities in Taiwan, South Korea, and China. Japan remains essential for supplying chemical solutions and precision stripping tools.

Middle East & Africa-

Early-stage growth in MEA with emerging tech zones in UAE and South Africa investing in electronics manufacturing.

List of Top Photoresist Stripping Equipment Companies-

1. Tokyo Electron Limited (TEL) – Global leader offering dry and wet stripping tools tailored for advanced semiconductor nodes.

2. Lam Research Corporation – Known for plasma etching and stripping tools used in sub-5nm technologies.

3. SCREEN Semiconductor Solutions – Specializes in wet process tools including resist strip and cleaning systems.

4. Hitachi High-Tech Corporation – Offers high-precision equipment for semiconductor cleaning and resist removal.

5. Applied Materials Inc. – Offers integrated dry strip and etch systems with advanced process control.

6. PVA TePla AG – Manufactures plasma-based cleaning systems suitable for MEMS and microelectronics.

7. Modutek Corporation – Provides wet bench and acid-based stripping systems used in R&D and small-volume fabs.

8. Rudolph Technologies (Onto Innovation) – Supplies wafer-level process control and stripping solutions.

9. ACM Research Inc. – Focuses on space-saving, modular cleaning tools for high-volume manufacturing.

10. Mattson Technology – Offers dry strip and plasma cleaning systems for logic and memory fabs.

Investment Analysis and Opportunities-

Capital investments in chip manufacturing from companies like Intel, Samsung, and TSMC will drive increased adoption of photoresist stripping systems. Emerging fabs in India and Vietnam represent high-growth investment hotspots.

New Product Development-

New stripping tools now come with integrated AI for real-time wafer diagnostics, eco-friendly chemical delivery systems, and support for hybrid wafer-level packaging applications.

Five Recent Developments-

1. TEL launched a new plasma-based system for 3nm logic chip production.

2. Lam Research partnered with a major U.S. foundry to co-develop low-damage strip technology.

3. SCREEN unveiled eco-strip systems with 50% lower chemical use.

4. Hitachi High-Tech introduced inline monitoring systems for resist removal.

5. ACM Research opened a new facility in Korea to support local equipment delivery and service.

Report Coverage-

This report offers comprehensive insights into the Photoresist Stripping Equipment Market from 2025 to 2033, including market sizing, CAGR, drivers, restraints, segment analysis, trends, competitive landscape, regional performance, company profiles, and future investment opportunities.